Colfax CX22825i-2T-X8 2U Rackmount Server

Innovative 2U Design with 4x 1U Half-Width Compute Nodes
2x 3rd Gen Intel® Xeon® Scalable Processors / Node
16x DDR4 DIMMS / Node
2x M.2 NVMe SSDs / Node
Intel® DSG System Debug Log Advisor (SDLA) New

Features

Download 3rd Gen Intel® Xeon® Scalable Processors Product Brief

Download 3rd Gen Intel® Xeon® Scalable Processors SKU Stack

Download Server System Solution Brief

Download Server System Technical Product Specifications

Innovative 2U Design with 4x 1U Half-Width Compute Nodes
2x 3rd Gen Intel® Xeon® Scalable Processors / Node
16x DDR4 DIMMS / Node
2x Riser Card Assemblies / Node
- Each Riser Card supports 1 PCI-E 4.0 x16 Low-Profile Slot & 1 80/110 mm PCIe or SATA M.2 SSD
Networking / Node
- 10Gb Ethernet Port (10GBASE-T)
- 1Gb Ethernet Port (1000BASE-T) Dedicated to Server Management
I/O Ports / Node
- 1x USB 3.0 Port
- 1x I/O Breakout Cable Connector Supporting the Following:
o 2x USB 3.0 Ports (Dual-Stack)
o 1x VGA Connector (routed to BMC VGA Controller with 16 MB of DDR4 video memory)
o 1x Serial Port Connector
Ethernet Management Port (EMP) Module Accessory Kit
- Offers 2x RJ45 Ports for Management of Compute Modules and System over 1Gbps Ethernet
- Port Forwarding
- Hot-Swappable
- Access to all present BMCs in the System with only 1x RJ45 Cable
- Daisy-chain capability to access multiple systems with one Ethernet connection
Intel® DSG System Debug Log Advisor (SDLA) New
- Enables customers to quickly and easily identify and resolve for themselves common server support issues
Five Dual-Rotor Hot-Swap System Fans with Support for Fan Redundancy
- Three 60 x 60 x 56 mm Fans
- Two 80 x 80 x 80 mm Fans
3x 2100W Power Supplies with Power Redundancy Support, 80PLUS Titanium

Technical Specifications


Chassis Form Factor	• 2U Rackmount • Dimension: 17.4"W (442mm) x 3.42"H (86.8mm) x 34.05"D (865mm)
CPU / Node	• Socket Socket-P4 4189 • Dual 3rd Gen Intel® Xeon® Scalable Processors • Supports Max CPU TDP up to 205W Note: Supported 3rd Gen Intel® Xeon® Scalable processor SKUs must Not end in (H), (L), or (U). All other processor SKUs are supported. Note: Previous generation Intel® Xeon® processor and Intel® Xeon® Scalable processor families are not supported
Chipset / Node	• Intel® C621A Chipset
Memory / Node	• 16x DDR4 DIMMs • All DDR4 DIMMs must support ECC • Registered DDR4 (RDIMM), 3DS-RDIMM, Load Reduced DDR4 (LRDIMM), 3DS-LRDIMM • Up to 3200 MT/s memory data transfer rates • Up to 2 TB DDR4 memory capacity (1 TB per processor) for all processor SKUs • DDR4 standard voltage of 1.2 V
I/O Expansion / Node	Riser 1 • PCIe slot (from CPU0): x16 (mechanical/electrical) low-profile PCIe 4.0 compatible • M.2 connector (from chipset): 80/110 mm SATA/PCIe 3.0 NVMe Riser 2 • PCIe slot (from CPU1): x16 (mechanical/electrical) low-profile PCIe 4.0 compatible • M.2 connector (from chipset): 80/110 mm SATA/PCIe 3.0 NVMe Note: The PCIe slots in riser 1 and 2 provide up to 25 W of power.
Networking / Node	• One external 10GBASE-T Ethernet port (RJ45) • One external 1000BASE-T Ethernet port (RJ45) dedicated for server management
I/O Ports / Node	• One USB 3.0 port • One I/O breakout cable connector supporting the following: o Two USB 3.0 ports (dual-stack) o One VGA connector (routed to BMC VGA controller with 16 MB of DDR4 video memory) o One serial port connector. The port follows AT pinout specifications Note: The I/O breakout cable is available as an option
Cooling	• Five dual-rotor hot-swap system fans with support for fan redundancy - Three 60 x 60 x 56 mm fans - Two 80 x 80 x 80 mm fans • One fan per installed power supply unit (PSU)
Power Supply	• Up to 3x 2100-watt AC power supplies with power redundancy support • 80PLUS Titanium Certified
Rack Mount Kit	• Tool-less installation • Travel distance: 536mm • Max supported weight: 60kg
Serviceability	Modular chassis features for simplified serviceability: • Fully independent modules • Hot-swappable power supplies • Hot-swappable system fans
Security Support	• Intel® Platform Firmware Resilience (Intel® PFR) technology • Intel® Software Guard Extensions (Intel® SGX) • Intel® Total Memory Encryption (Intel® TME) • Intel® CBnT – Converged Intel® Boot Guard and Trusted Execution Technology (Intel® TXT) • Trusted platform module 2.0 – iPC AXXTPMENC8 (accessory option)
Server Management	• Integrated baseboard management controller (BMC) based on the ASPEED* AST2500 Advanced PCIe* Graphics and Remote Management Processor • Intelligent Platform Management Interface (IPMI) 2.0 compliant • Redfish* compliant • Support for Intel® Data Center Manager (DCM) • Support for Intel® Server Debug and Provisioning Tool (SDPTool) • One external 1000BASE-T Ethernet port (RJ45) dedicated for server management • Onboard LEDs for Light Guided Diagnostics
BIOS	• Unified Extensible Firmware Interface (UEFI)-based BIOS (legacy boot not supported)
Operating Temperature	• 10–35 °C ambient temperature